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TSMC OIP Forum USA

The TSMC OIP Ecosystem Forum brings together TSMC's design ecosystem companies and customers to share practical, tested solutions to today's design challenges. Success stories that illustrate TSMC's design ecosystem best practices highlight the event. EPI partners participated with EPI materials on their exhibition space, which can be found here: https://www.european-processor-initiative.eu/dissemination-material/epi-flyer-tsmc-oip-forum-usa/
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Start:
26 09
@ 12:00
End:
26 09
@ 12:00
Place: Santa Clara, USA
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This project has received funding from the European High Performance Computing Joint Undertaking (JU) under Framework Partnership Agreement No 800928 and Specific Grant Agreement No 101036168 (EPI SGA2). The JU receives support from the European Union’s Horizon 2020 research and innovation programme and from Croatia, France, Germany, Greece, Italy, Netherlands, Portugal, Spain, Sweden, and Switzerland.

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