Home Dissemination Communication Press Repository EPI flyer @ TSMC OIP Forum USA

EPI flyer @ TSMC OIP Forum USA

Menta, EPI’s consortium partner, shared its exhibition space and hosted EPI materials at the TSMC OIP Forum, in Santa Clara, USA.

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Publication Type: Flyer
Year of Publication: 2019
Authors:
Publisher:
Name of publication/Event: TSMC OIP, Santa Clara, USA
ISSN Number:
Keywords:
URL: https://www.tsmc.com/Event/2019_NA_OIP/T5Dfsx27tn42/index.html
EPI c-fold flyer
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This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 826647

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