Home Dissemination Communication Press Repository EPI flyer @ TSMC OIP Forum USA

EPI flyer @ TSMC OIP Forum USA

Menta, EPI’s consortium partner, shared its exhibition space and hosted EPI materials at the TSMC OIP Forum, in Santa Clara, USA.

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Publication Type: Flyer
Year of Publication: 2019
Authors:
Publisher:
Name of publication/Event: TSMC OIP, Santa Clara, USA
ISSN Number:
Keywords:
URL: https://www.tsmc.com/Event/2019_NA_OIP/T5Dfsx27tn42/index.html
EPI c-fold flyer

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This project has received funding from the European High Performance Computing Joint Undertaking (JU) under Framework Partnership Agreement No 800928 and Specific Grant Agreement No 101036168 (EPI SGA2). The JU receives support from the European Union’s Horizon 2020 research and innovation programme and from Croatia, France, Germany, Greece, Italy, Netherlands, Portugal, Spain, Sweden, and Switzerland.

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