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EPI @ Embedded World

EPI’s partners participated in the Embedded world exhibition in Nürnberg, Germany, with their booths, presenting the latest EPI news and materials.

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Publication Type: Flyer
Year of Publication: 2020
Authors:
Publisher:
Name of publication/Event: Embedded World, Nürnberg, Germany
ISSN Number:
Keywords:
URL: https://www.embedded-world.de/en
EPI c-fold flyer
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This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 826647

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