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EPI @ EFECS

EPI team attended this year’s European Forum for Electronic Components and Systems in Helsinki, Finland. EPI exhibited posters and other materials at its booth, receiving many interested visitors and attendees.

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Publication Type: FlyerPosterRoll-up
Year of Publication: 2019
Authors:
Publisher:
Name of publication/Event: EFECS, Helsinki, Finland
ISSN Number:
Keywords:
URL:
EPI c-fold flyer
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This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 826647

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