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EPI @ EFECS

EPI team attended this year’s European Forum for Electronic Components and Systems in Helsinki, Finland. EPI exhibited posters and other materials at its booth, receiving many interested visitors and attendees.

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Publication Type: FlyerPosterRoll-up
Year of Publication: 2019
Authors:
Publisher:
Name of publication/Event: EFECS, Helsinki, Finland
ISSN Number:
Keywords:
URL:
EPI c-fold flyer

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This project has received funding from the European High Performance Computing Joint Undertaking (JU) under Framework Partnership Agreement No 800928 and Specific Grant Agreement No 101036168 (EPI SGA2). The JU receives support from the European Union’s Horizon 2020 research and innovation programme and from Croatia, France, Germany, Greece, Italy, Netherlands, Portugal, Spain, Sweden, and Switzerland.

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