What We Know about Alice Recoque, Europe’s Second Exascale System
SiPearl and Samsung Form Alliance to Enhance European Processor Technologies with HBM Integration
SiPearl partners with Samsung Electronics for built-in HBM in Rhea
SiPearl partners with Samsung for built-in HBM in Rhea
SiPearl chooses Italy to open its third international subsidiary
SiPearl unveils key features of the Rhea 1 to accelerate HPC and AI inference
80 Arm Neoverse V1 cores and in-package memory for SiPearl MCU
SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea
SiPearl’s Rhea1 Delivers Exceptional Compute Performance with 80 Arm Neoverse V1 Cores
SiPearl unveils features of Rhea1 HPC / AI inference processor

Copyright 2022 All Right Resereved

This project has received funding from the European High Performance Computing Joint Undertaking (JU) under Framework Partnership Agreement No 800928 and Specific Grant Agreement No 101036168 (EPI SGA2). The JU receives support from the European Union’s Horizon 2020 research and innovation programme and from Croatia, France, Germany, Greece, Italy, Netherlands, Portugal, Spain, Sweden, and Switzerland.