EPI Consortium members published “European Processor Initiative (EPI)—An Approach for a Future Automotive eHPC Semiconductor Platform” in the Electronic Components and Systems for Automotive Applications, proceedings of the 5th CESA Automotive Electronics Congress, Paris, 2018.
Here you can find a link to a post-peer-review, pre-copyedit version of an article published in Electronic Components and Systems for Automotive
Applications – Proceedings of the 5th CESA Automotive Electronics Congress, Paris, 2018. The final authenticated version is
available online at: http://dx.doi.org/10.1007/978-3-030-14156-1_15.
Link to OA: https://hpc.fer.hr/_download/repository/CESA_50_EPI_2018_final.pdf
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This project has received funding from the European High Performance Computing Joint Undertaking (JU) under Framework Partnership Agreement No 800928 and Specific Grant Agreement No 101036168 (EPI SGA2). The JU receives support from the European Union’s Horizon 2020 research and innovation programme and from Croatia, France, Germany, Greece, Italy, Netherlands, Portugal, Spain, Sweden, and Switzerland.